Parylene as thin flexible 3-D packaging enabler for biomedical implants

Jimin Maeng, Dohyuk Ha, William J. Chappell, Pedro P. Irazoqui

Research output: Contribution to conference › Paper › peer-review

Fingerprint

Dive into the research topics of 'Parylene as thin flexible 3-D packaging enabler for biomedical implants'. Together they form a unique fingerprint.

Keyphrases

Engineering