Initial stage of silver electrochemical migration degradation

S. Yang, J. Wu, A. Christou

Research output: Contribution to journalArticlepeer-review

50 Scopus citations


Silver electrochemical migration results in the degradation of surface insulation resistance, and has been attributed to the dendritic bridge between adjacent conductors. We report on the surface insulation resistance decrease prior to the dendritic bridge. The silver ECM mechanism in the initial stage of resistance decrease was analyzed and has been determined to be due to the continuous generation and accumulation of silver ions. Resistance decrease paths may be established prior to the appearance of dendritic migration paths. The investigation shows that the initial stage of ECM is also the rate controlling stage.

Original languageEnglish (US)
Pages (from-to)1915-1921
Number of pages7
JournalMicroelectronics Reliability
Issue number9-11
StatePublished - Sep 2006
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering


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