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Effective Imaging Window Analysis for Wearable Ultrasound Device Using Fetal MRI

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Wearable ultrasound devices can play a key role and enable revolutionary workflows in fetal monitoring applications in both antepartum and intrapartum phase of pregnancy. However, the fundamental question for developing wearable fetal monitoring solutions is whether the sensor is capable of performing continuous monitoring while being placed at a fixed location with minimum instruction to the user. Therefore, in this work, we developed a validation workflow using fetal MRI images to virtually place the wearable ultrasound scanner and examine the feasible placement window given the scanner design. This allows any scanner design being validated and optimized even before production. We showed that a scanner with a cone-shaped field-of-view with 18cm imaging depth can successfully monitor both the key heart and brain features throughout the critical period of delivery for fetal hypoxic-ischemic encephalopathy detection.

Original languageEnglish (US)
Title of host publicationIEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, UFFC-JS 2024 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350371901
DOIs
StatePublished - 2024
Event2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, UFFC-JS 2024 - Taipei, Taiwan, Province of China
Duration: Sep 22 2024Sep 26 2024

Publication series

NameIEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, UFFC-JS 2024 - Proceedings

Conference

Conference2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, UFFC-JS 2024
Country/TerritoryTaiwan, Province of China
CityTaipei
Period9/22/249/26/24

Keywords

  • Scanner Design
  • Simulation for scanner placement
  • Wearable ultrasound

ASJC Scopus subject areas

  • Signal Processing
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Acoustics and Ultrasonics
  • Instrumentation

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