Delicate manipulations with compliant mechanism and electrostatic adhesion

Xinquan Liang; Yi Sun; Hongqiang Wang; Raye C H Yeow; Sunil L. Kukreja; Nitish V Thakor; Hongliang Ren

doi:10.1109/BIOROB.2016.7523660

Delicate manipulations with compliant mechanism and electrostatic adhesion

Xinquan Liang, Yi Sun, Hongqiang Wang, Raye C H Yeow, Sunil L. Kukreja, Nitish V Thakor, Hongliang Ren

School of Medicine

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Scopus citations

Abstract

Traditional rigid robotic hand manipulator has been used in many field nowadays due to its advantages of large gripping force and stable performance. However, this kind of rigid manipulator is not suitable for gripping fragile objects since it is motorized and force control can be a problem. It is also not suitable to grip object with different shapes since the manipulator is rigid and not compliant. In this study, a novel manipulator with gripping capability is designed and fabricated. The manipulator combines electrostatic adhesion actuation with soft manipulators. The manipulator has high flexibility and can be compliant to different shapes due to the property of the materials. It is very promising to do delicate manipulations in industry field and biomedical field.

Original language	English (US)
Title of host publication	2016 6th IEEE International Conference on Biomedical Robotics and Biomechatronics, BioRob 2016
Publisher	IEEE Computer Society
Pages	401-406
Number of pages	6
Volume	2016-July
ISBN (Electronic)	9781509032877
DOIs	https://doi.org/10.1109/BIOROB.2016.7523660
State	Published - Jul 26 2016
Event	6th IEEE RAS/EMBS International Conference on Biomedical Robotics and Biomechatronics, BioRob 2016 - Singapore, Singapore Duration: Jun 26 2016 → Jun 29 2016

Other

Other	6th IEEE RAS/EMBS International Conference on Biomedical Robotics and Biomechatronics, BioRob 2016
Country/Territory	Singapore
City	Singapore
Period	6/26/16 → 6/29/16

ASJC Scopus subject areas

Artificial Intelligence
Biomedical Engineering
Mechanical Engineering

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10.1109/BIOROB.2016.7523660

Cite this

Liang, X., Sun, Y., Wang, H., Yeow, R. C. H., Kukreja, S. L., Thakor, N. V., & Ren, H. (2016). Delicate manipulations with compliant mechanism and electrostatic adhesion. In 2016 6th IEEE International Conference on Biomedical Robotics and Biomechatronics, BioRob 2016 (Vol. 2016-July, pp. 401-406). Article 7523660 IEEE Computer Society. https://doi.org/10.1109/BIOROB.2016.7523660

Delicate manipulations with compliant mechanism and electrostatic adhesion. / Liang, Xinquan; Sun, Yi; Wang, Hongqiang et al.
2016 6th IEEE International Conference on Biomedical Robotics and Biomechatronics, BioRob 2016. Vol. 2016-July IEEE Computer Society, 2016. p. 401-406 7523660.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Liang, X, Sun, Y, Wang, H, Yeow, RCH, Kukreja, SL, Thakor, NV & Ren, H 2016, Delicate manipulations with compliant mechanism and electrostatic adhesion. in 2016 6th IEEE International Conference on Biomedical Robotics and Biomechatronics, BioRob 2016. vol. 2016-July, 7523660, IEEE Computer Society, pp. 401-406, 6th IEEE RAS/EMBS International Conference on Biomedical Robotics and Biomechatronics, BioRob 2016, Singapore, Singapore, 6/26/16. https://doi.org/10.1109/BIOROB.2016.7523660

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AU - Liang, Xinquan

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AU - Thakor, Nitish V

AU - Ren, Hongliang

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Delicate manipulations with compliant mechanism and electrostatic adhesion

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