CHIP-PLACEMENT ALIGNMENT TECHNIQUE.

M. S. Chester; M. A. Lavin; R. H. Taylor

CHIP-PLACEMENT ALIGNMENT TECHNIQUE.

M. S. Chester, M. A. Lavin, R. H. Taylor

Research output: Contribution to journal › Article › peer-review

Abstract

Chip positioning by relating the positions of solder balls and mating connection pads (vias) indirectly - by determining the positional relationship of balls and of vias separately to a reference mark, rather than to each other - increases total positional accuracy and convenience. Two measured relationships are outlined. They can be used to determine the solder ball/via pad misalignment and from that determination produce a command to the placement tool to correct the misalignment.

Original language	English (US)
Pages (from-to)	3653-3655
Number of pages	3
Journal	IBM technical disclosure bulletin
Volume	27
Issue number	6
State	Published - Nov 1984
Externally published	Yes

ASJC Scopus subject areas

General Engineering

Cite this

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title = "CHIP-PLACEMENT ALIGNMENT TECHNIQUE.",

abstract = "Chip positioning by relating the positions of solder balls and mating connection pads (vias) indirectly - by determining the positional relationship of balls and of vias separately to a reference mark, rather than to each other - increases total positional accuracy and convenience. Two measured relationships are outlined. They can be used to determine the solder ball/via pad misalignment and from that determination produce a command to the placement tool to correct the misalignment.",

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year = "1984",

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AU - Chester, M. S.

AU - Lavin, M. A.

AU - Taylor, R. H.

PY - 1984/11

Y1 - 1984/11

N2 - Chip positioning by relating the positions of solder balls and mating connection pads (vias) indirectly - by determining the positional relationship of balls and of vias separately to a reference mark, rather than to each other - increases total positional accuracy and convenience. Two measured relationships are outlined. They can be used to determine the solder ball/via pad misalignment and from that determination produce a command to the placement tool to correct the misalignment.

AB - Chip positioning by relating the positions of solder balls and mating connection pads (vias) indirectly - by determining the positional relationship of balls and of vias separately to a reference mark, rather than to each other - increases total positional accuracy and convenience. Two measured relationships are outlined. They can be used to determine the solder ball/via pad misalignment and from that determination produce a command to the placement tool to correct the misalignment.

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CHIP-PLACEMENT ALIGNMENT TECHNIQUE.

Abstract

ASJC Scopus subject areas

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