Advanced 3D packaging of miniature biomedical sensors

Dohyuk Ha, Tse Yu Lin, Byung Guk Kim, Pedro P. Irazoqui, William J. Chappell

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, a novel 3D packaging technique for miniature implantable wireless biomedical sensors for intraocular pressure (IOP) sensing in mice is introduced. Due to the limited size of a mouse eye, the packaging of the sensor and control integrated circuit (IC) is very challenging. The overall size of the packaged sensor must be less than 12 mils cubed. In order to achieve the desired thickness, a magnetically aligned Z-axis anisotropic conductive adhesive (ACA) is used to create the vertical interconnects and micro-vias in the packaging material to distribute signals vertically to limit the eventual area of the device. The first step is to demonstrate the layer-to-layer interconnection between a silicon IC and a liquid crystal polymer (LCP) layer using the Z-axis ACA. The total thickness of the IC and the packaging layer is less than 6 mils. The measured resistance through vertical interconnection is 1.15 ohms on average for 3 mil x 3 mil pads. The second step is to demonstrate 3D transitions through 0.8 mil via holes in a LCP layer. A transition from an antenna layer through the LCP to a rectifier circuit on the above layer is demonstrated. RF power received by a loop antenna on the bottom LCP layer is rectified and generates 5 volts of DC voltage. This miniature 3D packaging technique enables extremely tight integration of all the sensor's components in a small form factor package, which can be implanted into mice eyes for wireless monitoring of the intraocular pressure. Copyright

Original languageEnglish (US)
Title of host publication43rd International Symposium on Microelectronics 2010, IMAPS 2010
Pages543-547
Number of pages5
StatePublished - 2010
Externally publishedYes
Event43rd Annual IMAPS International Symposium on Microelectronics, IMAPS 2010 - Raleigh, NC, United States
Duration: Oct 31 2010Nov 4 2010

Publication series

Name43rd International Symposium on Microelectronics 2010, IMAPS 2010

Conference

Conference43rd Annual IMAPS International Symposium on Microelectronics, IMAPS 2010
Country/TerritoryUnited States
CityRaleigh, NC
Period10/31/1011/4/10

Keywords

  • 3D packaging
  • Biomedical application
  • LCP
  • Z-axis ACA

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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