@inproceedings{e2d17f8267a643aa872485532f02f43d,
title = "A three dimensional self-folding package (SFP) for electronics",
abstract = "We describe the concept of a 3D self-folding package (SFP) for sensors and electronic devices. The strategy is based on a self-assembly strategy wherein 2D panels interconnected with hinges spontaneously fold-up when they are released from the substrate; self-folding can be triggered by temperature or selected chemicals. The strategy enables packaging of devices in porous polyhedral geometries that can either be untethered or substrate-bound. Self-folding can enable packaging of devices in small 3D form factors and may enable efficient cooling due to porosity. The utilization of this self-folding platform to enable 3D packaging of cantilever sensors and magnetic field sensitive strain gauges is summarized.",
author = "Cho, \{Jeong Hyun\} and Steve Hu and Gracias, \{David H.\}",
year = "2010",
language = "English (US)",
isbn = "9781605112268",
series = "Materials Research Society Symposium Proceedings",
pages = "317--321",
booktitle = "Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics",
note = "2010 MRS Spring Meeting ; Conference date: 05-04-2010 Through 09-04-2010",
}