3D packaging technique on liquid crystal polymer (LCP) for miniature wireless biomedical sensor

Dohyuk Ha, Byung Guk Kim, Tse Yu Lin, Yuehui Ouyang, Pedro Irazoqui, William J. Chappell

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a novel 3D packaging technique for a miniature wireless biomedical sensor. The end goal of this sensor is for implantation into the eye of a mouse, therefore size is extremely limited. The application makes the packaging of the sensor and control of IC a difficult challenge. The thickness of the unit must be less than 300 microns total. It is demonstrated in this paper that the thickness requirement can be met using novel epoxy interconnects and that micro-vias can be implemented in the package to distribute signals vertically to limit the eventual area of the device. First, the layer-to-Iayer interconnection between silicon and liquid crystal polymer (LCP) layers is demonstrated using a magnetically aligned Z-axis anisotropic conductive adhesive (ACA). The total thickness of the IC and the packaging layer is less than 150 microns. The resistance through Z-axis ACA represented 1.15 ω on average for 75 micron pads. Second, 3D transitions through LCP via holes of 20 μm are demonstrated, which are suitable to distribute signals through the small form factor unit. In this paper, we demonstrate transition from an antenna layer through the LCP to a layer above where a rectifier resides. RF power received by a loop antenna on the bottom LCP layer is transferred to the rectifier on the top layer and generates 5 volts of DC voltage. These miniature 3D packaging techniques could make it possible to integrate all components in the small area (500 μm × 500 μm) to implement an implanted wireless biomedical micro-sensor.

Original languageEnglish (US)
Title of host publication2010 IEEE MTT-S International Microwave Symposium, MTT 2010
Pages612-615
Number of pages4
DOIs
StatePublished - 2010
Externally publishedYes
Event2010 IEEE MTT-S International Microwave Symposium, MTT 2010 - Anaheim, CA, United States
Duration: May 23 2010May 28 2010

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
ISSN (Print)0149-645X

Conference

Conference2010 IEEE MTT-S International Microwave Symposium, MTT 2010
Country/TerritoryUnited States
CityAnaheim, CA
Period5/23/105/28/10

Keywords

  • Anisotropic conductive adhesive
  • Biomedical application
  • LCP
  • RF 3D-Packaging
  • Vertical interconnections

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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